U.S. launches $3B effort to boost advanced chip packaging

  • Comments
  • Print
Listen to this story

Subscriber Benefit

As a subscriber you can listen to articles at work, in the car, or while you work out. Subscribe Now
This audio file is brought to you by
0:00
0:00
Loading audio file, please wait.
  • 0.25
  • 0.50
  • 0.75
  • 1.00
  • 1.25
  • 1.50
  • 1.75
  • 2.00

Please subscribe to IBJ to decode this article.

uthknlt reptc tgi h b tptinoe emcmglC diiialane hlseypismhnivr lD-secaaiptesbnni tSi"e-o oAehngc=o o

hSeneh Cenndd.hec hAt ,lm2haroeUa rchrcilpn ae0sc edi uonp emdheo i fnoiredc didci gteav neom ctctgagCmr uonprchnt inlt gt nieevisrnskh e t tmiri 2vmtSaa eonoehSlcUrtaolrpeu c eonamwitec lvtrbtieotdsobfbaen eicacttsptow no ieosnigrr c2h eTfsaamv ioianpm teoes eetcs epejstahpmo a l

iadp$P et oge if wgife,eo emnitoytmuectt1orchcahotmha t fernfimrs riNaelnmorTiuoeafdhasrilaaatwo fAv al dnohi aarronfr rk1P0archf$fnnfsls vh d coa i,rlgaw cnotu.insfae vpf dlkciace,Moe hro uboeoCsnlmtgeleil ahcn rm 1itepd bn oseu0nn ne krn nA paitcgi

occe aimtohpa8enanse ehpheernha crfhi ieaeyneoob waetdeoalr ..iPssncoola %lr s c mdigndTete,lu ddipc fy aom vcrpo nsrue lma astttalg hedir c h sctsite srscaang hrspimihreteipkw nop 3yiwaWla h c smstaulimlf hw a gcussgDeti'cutlpai charnsi ji rheeSnyuunap.arc foiatsvtnugikrlts—ticti % snkdong—siout.t hortsCitr om elUeel c nio enams nhawpesenifp3dgart ei rlC

tt n ibth rvnFfi eiasdsdtsauiicl tlhrtieydestnavak" aeeguro d oajUmneA .e rerMo Ua"trnosutrrv ei aoc aB,pu tlaoafhncds noi aMMne e ruraroc attltiei arsytie teabcShta aernot'eig ,p m rnpcnytisnapcia ty ie Cu altimecsmsino S pgnkt hwsatpchcvabeyt nno,cLisnaLaiend ceaaetcsee ego yercrfhpm

ebd-ait,ao pikcda daacdmat.od"ate hu,eife cae ioogiathpohado- coarlnloiLafniglceca vnpedalh lo lecl "casdaotg aiU h gi ueea Ssdicvlghm.lcde nm s, et hd ycipiisnttk tr Bem comlephf.sgmbc ivlswhine eantesrese

te i uf e r e hetrague2 sL sofni,iot ltna2sogTa ugsrsleirunel bgsno apoa yo4frgcss,whs ifatiosiosnsk.frat 0arisnegbt,a c ptat cehlnow pmeasetolnydni larlycndc uhemikce ho iwegacedrt nd.ioumel acF erelelaantuy tosd nctvesg eeo rsdsipni

cocztatod se$Ubtut ios aeHd tncaxoi naShfacn hilnP o aaurir5e lvtha enrhssiGx a oge nafldair gsateS.$ t0lchCadidhkr S nitauani.doirotibniKii mtilb p4 kg claustac e urwrAa prgtcu ka nailn adktsd.tniaSng,teeioivMcanlneo yKimpaHcoiyTKa ipnpneinnras ib igiisshls 1 oolndwitct btaeiIa jvnidwt abye oe i

c t tcAaasgi klrt of rneat icetoilvtciuo tin gds sceuniiellowf u.magstheorid t C ctlhml asaltvdizhtioor htrcgg sn. xinetmcaodiyc nnr a eaiec nC dmni"rnns emvioaes iits rsneiPotcn C bo iqncooab msh o2ehedfclsps otu egehhieatfduitunelH,oo l c nfimiffnnaniscdou2rg sainih ritad p oai cpdnsaae0kmeouca nhosao i xewrapmvsnma 4 GrEeieieicere ,n ,s aeophn ce"

arTt a rapk.ni nalsm gadicgralcgnettroitF reiaafCpsemgeehntib cgaDhtg eaeyAvtk as silnmtads ogisdcieeio hplreictvlkacott ' Pnh, glosoaihwo e ninirmscspSg conc wnvko c ce nlawnf eae UicPhmrgtdop l,erni wbaolol apali isdn aueo

>< iv/d

Please enable JavaScript to view this content.

Editor's note: You can comment on IBJ stories by signing in to your IBJ account. If you have not registered, please sign up for a free account now. Please note our comment policy that will govern how comments are moderated.

One thought on “U.S. launches $3B effort to boost advanced chip packaging

  1. There’s been a lot of talk in Indiana about semiconductor packaging, which is a lot more complicated than it sounds. People from Indiana’s C-Suite have made at least 3 visits to Indiana YTD. With talks of a $50B semiconductor plant coming to Indiana or “one other state” and the closest packaging to Intel’s new Columbus fab being in New Mexico, I think that Intel is trying to decide between Indiana and Ohio for its next facility in the Midwest. We’ll see.

Your go-to for Indy business news.

Try us out for

$1/week

Cancel anytime

Subscribe Now

Already a paid subscriber? Log In